Design, Modeling, and Characterization of Three Dimensional Integrated Circuits
Khaled Salah Mohammed;
Abstract
This dissertation presents a wide-band SPICE-compatible RLC model for TSVs in 3D ICs. This model accounts for a variety of effects, including skin effect, depletion capacitance, and (more novel) nearby contact effects. The TSV is modeled like a MOS struct
Other data
| Title | Design, Modeling, and Characterization of Three Dimensional Integrated Circuits | Authors | Khaled Salah Mohammed | Keywords | Design, Modeling, and Characterization of Three Dimensional Integrated Circuits | Issue Date | 2012 | Description | This dissertation presents a wide-band SPICE-compatible RLC model for TSVs in 3D ICs. This model accounts for a variety of effects, including skin effect, depletion capacitance, and (more novel) nearby contact effects. The TSV is modeled like a MOS struct |
Attached Files
| File | Size | Format | |
|---|---|---|---|
| 112631p6712.pdf | 364.81 kB | Adobe PDF | View/Open |
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