Indentation Creep and Microstructure Properties of Sn-Ag Solder Alloys
Amal Mohamad Yassin; B.A. Khalifa; R. Afify Ismail;
Other data
Title | Indentation Creep and Microstructure Properties of Sn-Ag Solder Alloys | Authors | Amal Mohamad Yassin ; B.A. Khalifa; R. Afify Ismail | Keywords | Creep , snag solder alloys | Issue Date | 2019 | Journal | Journal of Advances in Physics | Volume | 16 | Start page | 171 | End page | 184 |
Recommend this item
Similar Items from Core Recommender Database
Items in Ain Shams Scholar are protected by copyright, with all rights reserved, unless otherwise indicated.