Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder
Amal Mohamad Yassin;
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| Title | Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder | Authors | Amal Mohamad Yassin | Keywords | Creep, thermal properties, lead free solder | Issue Date | 2019 | Journal | Arab Journal of Nuclear Sciences and Applications | Volume | 52 | Start page | 1 | End page | 15 |
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