Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders
Amal Mohamad Yassin; R. Afify Ismail; B.A. Khalifa;
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| Title | Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free Solders | Authors | Amal Mohamad Yassin ; R. Afify Ismail; B.A. Khalifa | Keywords | creep, alloys | Issue Date | 2018 | Journal | Journal of Advances in Physics | Volume | 14 | Start page | 5835 | End page | 5850 |
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