Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder
Amal Mohamad Yassin; H. Y. Zahran; A. F. Abd El-Rehim;
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| Title | Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder | Authors | Amal Mohamad Yassin ; H. Y. Zahran; A. F. Abd El-Rehim | Keywords | Nanoparticles, Microstructure, Creep | Issue Date | 2018 | Journal | Journal of Electronic Materials | Volume | 47 | Start page | 6984 | End page | 6994 |
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