The Study of Microstructure and Creep Properties of Cu-Doped Sn-4wt%Ag and Sn-9wt%Zn Lead Free Solders with Annealing Temperature
A.M.Yassin; E. Gomaa;
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| Title | The Study of Microstructure and Creep Properties of Cu-Doped Sn-4wt%Ag and Sn-9wt%Zn Lead Free Solders with Annealing Temperature | Authors | A.M.Yassin ; E. Gomaa | Keywords | Creep, lead free solder, creep resistance | Issue Date | 2015 | Journal | Physical Science International Journal | Start page | 163 | End page | 171 |
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