Impact of adding TiO2 nanoparticles (NP), strain rate and testing temperature on the stress-strain characteristics of Sn-5wt % Sb - 2wt %In lead solder alloy

Abstract

In this paper, the impact of adding 0.2 % TiO2 nanoparticles (NP) on the microstructural evolution, thermal behavior and tensile response of Sn- %Sb-2 % In (SSI) ordinary solder was characterized by Optical Microscope (OM), Scanning electron microscope (SEM), XRD and EDS. The morphology results showed that adding TiO2 NP resulted in the refinement of the formed SbSn, SbIn (IMCs) and the β-Sn grains were also markedly refined with the addition of TiO2 NP. Impact of refinement caused by TiO2 NP on the microstructure and tensile features of SSI alloy has been investigated. Impact of refinement caused by TiO2 NP has been examined on the microstructural morphology and properties of Sn-5Sb-2In- TiO2 (composite solder). SEM examinations indicated that SbSn IMC, have a cuboid structure. The morphology of SbSn was refined after including TiO2 NP SbSn morphology was obviously refined. Differential Scanning Calorimetry (DSC) demonstrated minor increment within the dissolving temperature (ΔTm~ 0.66 o C) of SSI (composite). TiO2 NP to the SSI makes composite joints to be progressively employable in plunging the event of the overall IMC particles (SbSn, and SbIn) within the scope of temperature utilized immediately