Enhancement of Structural and Creep Properties of Sn-5 wt% Zn Solder Reinforced with Nano-metric Particles of Al2O3

Abstract

Sn-Zn alloy has been taken as one of the most important lead free solder alloys due to toxicity and alpha radiation effects of lead impurities. Strain-time relations of Sn-5 wt.%Zn and Sn-5 wt.%Zn-0.5 wt.%Al2O3 alloys were obtained under different constant stresses (10-25 MPa) over a temperature range from 333 K to 393 K. The results of this study shows the transient creep parameters dependence on the testing temperature and the applied stress of both compounds. This work, study the effect of adding Al2O3 nano-particles to Sn-5 wt.%Zn on the thermal, structural and tensile creep properties. The addition of Al2O3 nano-particles slightly changed the thermal properties, but improved the tensile creep resistance.