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D.M.Habashy
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Issue Date
Title
Author(s)
2-Jul-2024
Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling.
Ibrahem Mohamed, Hanem
; D.M.Habashy
; M.M.Mousa
