Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles

A.M.Yassin; A.F.Abd El‑Rehim; H. Y. Zahran;

Other data

Title Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles
Authors A.M.Yassin ; A.F.Abd El‑Rehim; H. Y. Zahran
Keywords Creep, microstructure, lead free solder
Issue Date 2-Jan-2019
Volume 30
Start page 2213
End page 2223
DOI 10-1007/s108-0492-0

Recommend this item

Similar Items from Core Recommender Database

Google ScholarTM

Check

views 21 in Shams Scholar
Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles


Items in Ain Shams Scholar are protected by copyright, with all rights reserved, unless otherwise indicated.