Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling
Ibrahem Mohamed, Hanem; D. M. Habashy; M. M. Mousa;
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| Title | Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling | Authors | Ibrahem Mohamed, Hanem ; D. M. Habashy; M. M. Mousa | Issue Date | 2024 | Journal | Journal of Electronic Materials | Volume | 53 | Issue | 9 | Start page | 5486 | End page | 5504 | ISSN | 0361-5235 1543-186X |
DOI | http://dx.doi.org/10.1007/s11664-024-11235-1 |
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