Effect of Third Addition on Structural and Tensile Properties of a Binary Tin-Based Solder Alloy
Esmat Shawky Khalil;
Abstract
The eutectic Sn-Zn and Sn-Zn-Ag solders are currently considered as lead free replacement candidates for Sn-Pb eutectic alloys in microelectronics applications. In this study, Sn-8.8wt%Zn and Sn-8.8wt%Zn-1.5wt%Ag solder alloys were prepared from high puri
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| Title | Effect of Third Addition on Structural and Tensile Properties of a Binary Tin-Based Solder Alloy | Other Titles | تأثير إضافة عنصر ثالث على الخصائص التركيبية وخصائص الشد على سبيكة لحام ثنائية قاعدتها القصدير | Authors | Esmat Shawky Khalil | Keywords | Effect of Third Addition on Structural and Tensile Properties of a Binary Tin-Based Solder Alloy | Issue Date | 2010 | Description | The eutectic Sn-Zn and Sn-Zn-Ag solders are currently considered as lead free replacement candidates for Sn-Pb eutectic alloys in microelectronics applications. In this study, Sn-8.8wt%Zn and Sn-8.8wt%Zn-1.5wt%Ag solder alloys were prepared from high puri |
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