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H. Y. Zahran
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Showing results 1 to 3 of 3
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Issue Date
Title
Author(s)
2018
Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based Solder
Amal Mohamad Yassin
; H. Y. Zahran; A. F. Abd El-Rehim
8-Jan-2021
Mathematical Modelling of Vickers Hardness of Sn-9Zn-Cu Solder Alloys Using an Artificial Neural Network
H.N.Soliman
; A. F. Abd El‑Rehim; D. M. Habashy; H. Y. Zahran
2-Jan-2019
Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticles
A.M.Yassin
; A.F.Abd El‑Rehim; H. Y. Zahran
