Browsing by Author A.M.Yassin

Showing results 1 to 11 of 11
Issue DateTitleAuthor(s)
1999Effect of annealing and microstructure on the creep behavior of Sn-10wt.%Sb alloysA.M.Yassin ; M.H. Nagy; S.K. Habib; R.L.Rueben
1998Effect of SnSb Particle Size on Creep Behaviour under power low regime of Sn-10%SbA.M.Yassin ; M.H. Nagy; S.K. Habib
2018Effect of TiO2 Nanoparticles Addition on the Thermal, Microstructural and Room-Temperature Creep Behavior of Sn-Zn Based SolderAmal Mohamad Yassin ; H. Y. Zahran; A. F. Abd El-Rehim
2019Effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solderAmal Mohamad Yassin 
2009Enhancement of Electrical Conductivity by Al-Doped ZnO Ceramic VaristorsA.M.Yassin ; A. Sedky; Ayman Al-Sawalha
2019Indentation Creep and Microstructure Properties of Sn-Ag Solder AlloysAmal Mohamad Yassin ; B.A. Khalifa; R. Afify Ismail
2018Influence of Low Ti-Element Additions on The Microstructure, Melting Properties and Creep Behavior of Sn-Ag-Cu Lead Free SoldersAmal Mohamad Yassin ; R. Afify Ismail; B.A. Khalifa
2018Investigation of Microstructure and Creep Properties of Sn-xSb Solder Alloys up to Peritectic CompositionAmal Mohamad Yassin 
2-Jan-2019Microstructure evolution and tensile creep behavior of Sn–0.7Cu lead-free solder reinforced with ZnO nanoparticlesA.M.Yassin ; A.F.Abd El‑Rehim; H. Y. Zahran
2017Structure Analysis, Enhancement of Creep Resistance and Thermal Properties of Eutectic Sn-Ag Lead-Free Solder Alloy by Ti and Cd AdditionsA.M.Yassin ; B.A.Khalifa; R.Afify Ismail
2015The Study of Microstructure and Creep Properties of Cu-Doped Sn-4wt%Ag and Sn-9wt%Zn Lead Free Solders with Annealing TemperatureA.M.Yassin ; E. Gomaa
Showing results 1 to 11 of 11